Sika is actively advancing Debonding on Demand (DoD) technologies to meet future circular design requirements across a wide range of applications—including battery cells and modules, automotive hang-on parts, consumer goods, and electronics.
Advancing Circularity with Intelligent Debonding Mechanisms
Sika is actively advancing Debonding on Demand (DoD) technologies to meet future circular design requirements across a wide range of applications—including battery cells and modules, automotive hang-on parts, consumer goods, and electronics. These solutions incorporate multiple triggerable mechanisms that allow bonded assemblies to be safely and efficiently separated at end of life—without compromising initial performance.
The four main debonding mechanisms include:
- Weak-link chemistries using expandable filler systems or thermal debonding primersEmbrittlement through controlled fracture propagation, reducing load transfer capability
- Peelable adhesives with intentionally strong cohesive forces
- CIPG (Cured-in-Place Gaskets) for flexible sealing in large, complex geometries
Activation can be achieved through heat, electric fields, UV/VIS radiation, or mechanical triggers. These technologies enable controlled loss of adhesion, support design for disassembly, reduce waste streams, and facilitate recycling of high-value materials such as aluminum, steel, composites, and battery components.